Microtechnology Development

Northrop Grumman provides experience in MEMS technology and high-temperature packaging, as well as unique microtechnology solutions for physical sensing applications, such as wall shear, pressure, and material recession rates, and solutions for adaptive thermal management. The company's personnel have worked on the following projects:

  • MEMS SiC shear stress sensor for hypersonic applications (for AEDC)
  • MEMS-based PEM fuel cell
  • MEMS micro-catalytic reactor technology development
  • MEMS Ablation Recession Rate Sensor-MARRS sensor for NASA Ames
  • MEMS optical-shear stress sensor for NASA Langley.

Northrop Grumman's Microfluidics and Fuel Cell Test Laboratory is a 500-square-foot Class 10,000 clean room with its own independent data acquisition and control system. This facility allows MEMS device wet etching and characterization. Testing of proof-of-concept systems can be performed here.

The Wafer Inspection Station allows light inspection and high-resolution imaging of wafers using a dual epi-fluorescence cube module in conjunction with an external illumination/imaging system.

Northrop Grumman also offers user access to the Cornell Nanoscale Science and Technology Facility.

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