Maskmaking / E-Beam Lithographic Operations

Inside view of the E-Beam Lithographic Operations facility.

The E-Beam Lithographic Operations of Northrop Grumman's Advanced Technology Center are located within minutes of the Baltimore-Washington Airport in Linthicum, Maryland. This DoD-secure, ISO-9001-certified facility has been delivering on-time quality to our internal and external customers for more than 25 years and is available to help you with your specific advanced lithographic needs.

Direct-write e-beam lithography for nanoscale devices is ideal for advanced device prototyping. Our direct-write e-beam lithography has been used for layers where feature size is critical (10’s of nms) or precise feature alignment is need ( ˂10 nm across wafer) or both.

Our in-house capabilities have been instrumental in production of state-of-the-art microelectronic devices and integrated circuits including:

  • Microwave
  • Radiation hardened
  • Mixed signal, very low-power/high-speed analog ADCs
  • ASICs
  • CCDs for high-value-added system insertion leverage
  • CNTs

We offer an advanced capability that can satisfy your most stringent technical requirements with fast turnaround at a competitive price (avoiding prohibitive mask costs), providing small businesses with incentives normally enjoyed only by large companies.