Sr. Principal Engineer RF Microwave & Mixed Signal Design-19016457

Location: Baltimore
US Citizenship Required for this Position: Yes
Relocation Assistance: Yes
Clearance Type: Secret
Number of Openings : 5
Shift : 1st Shift

RF Microwave and Mixed Signal Design

Northrop Grumman Mission Systems sector delivers a decisive advantage to its customers through software-defined, hardware-enabled solutions. The Electrical Design & Technology department in Linthicum, MD enables these hardware solutions by providing RF microwave and mixed signal architecture, design, verification, and support expertise across a wide variety electronic sensor products. Our engineers work on complex, leading edge, high reliability electronics supporting maritime, ground, airborne, and space platforms.

Whether you are looking for detailed design, modeling and simulation, hands-on verification testing and troubleshooting, or working with internal or external fabricators and integrators, there is a role for you in our department.

NGMS is seeking engineers with experience and interest in electronic assembly and packaging design including:

  • Deriving and trading requirements with subsystem engineers and component level designers

  • Managing RF budgets, frequency planning, and common assembly level interfaces

  • Designing, modeling, and verifying RF and mixed signal subsystem assemblies

  • Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques

  • Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements

  • Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test

  • Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test

  • Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more

  • Supporting products throughout the product life cycle

  • RF and mixed signal product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver / exciter assemblies, signal conditioning assemblies, signal generators, and transmit / receive assemblies

This position is located in Linthicum, MD with easy access to the major cities of Baltimore to the north and Washington DC to the south. The location is a 2 hour drive to the Atlantic Ocean to the east or the Appalachian Mountains to the north and west. The area is rich with activities including historical sites, museums, concerts and performing arts venues, college and professional sports, nightlife, and many outdoor activities most notably boating and fishing on the Chesapeake Bay and surrounding rivers. The Linthicum campus includes the potential to live in urban, suburban, and waterfront communities within easy commutes and is conveniently located adjacent to the BWI International Airport and an Amtrak rail station.

Our engineers share a great sense of pride knowing their contributions have a direct effect on the security and safety of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to work to accomplish the mission while learning and having fun along the way. Our department is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions.










Basic Qualifications: 

  • Electrical Engineering or equivalent STEM field degree: Bachelor of Science with 9 years of experience; Masters degree with 7 years of experience; PhD degree with 4 years of experience 
  • Ability to obtain and maintain a DoD Security Clearance,US Citizenship is required

  • Effective verbal and written communication skills

 Industry experience in one or more of the following areas:

  • RF and mixed signal printed circuit board and circuit card assembly level design

  • RF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysis

  • Component selection and/or custom component requirements flow down and trades

  • Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes

  • Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip

  • RF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.

  • Electronic troubleshooting from component to assembly levels

  • Complex data reduction and analysis

  • Product life cycle support from concept through production support

  • Designing for high reliability, mil/aero requirements and environments

  • AESA / phased array, Radar, SIGINT, or SATCOM experience

  • Technical leadership

  • Software tools: Mentor Xpedition DX Designer, ANSYS HFSS, Keysight ADS, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)

Preferred Qualifications: 

  • Secret or Top Secret / SCI security clearance
    Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.


Job ID: 19016457