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Mechanical Chip-Package Interaction (CPI) Modeling Engineer

Requisition ID: R10082806

  • Category IconCategory: Engineering
  • Location Icon Location: Linthicum, MD, USA   |  Unknown, VA, USA +1 more
  • Citizenship IconCitizenship Required: United States Citizenship
  • Clearance IconClearance Type: None
  • Telecommute IconTelecommute: Yes- May Consider Full Time Teleworking for this position
  • Shift IconShift: 1st Shift (United States of America)
  • Travel IconTravel Required: Yes, 10% of the Time
  • Positions IconPositions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

As an IC Package Modeling Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to be a part of our Enterprise-wide digital transformation. Through the use of Model-based Engineering, DevSecOps and Agile practices we continue to evolve how we deliver critical national defense products and capabilities for the warfighter. Our success is grounded in our ability to embrace change, move quickly and continuously drive innovation.


The successful candidate will be collaborative, open, transparent, and team-oriented with a focus on team empowerment & shared responsibility, flexibility, continuous learning, and a culture of automation. We are seeking an enthusiastic, motivated engineer to join our team at our Linthicum, Maryland location.

Job responsibilities include, but are not limited to:

  • Develop thermo-mechanical and mechanical FEA models and perform simulations to support package assembly process and reliability/qualification testing.
  • Evaluate designs for manufacturability and reliability; oversee metrology and failure analysis of packaging components
  • Analyze, model, and interpret data for advanced package development and related areas and provide material, structural, and assembly/fab process condition recommendations.
  • Iterate between developing FEA or other models and experimental validation.
  • Work within a lab environment and perform root-cause analysis of electronic hardware using failure analysis tools/techniques: Mechanical Cross-Sectioning, Optical Microscopy, Acoustic Microscopy (C-SAM) and Scanning Electron Microscopy (SEM).
  • Use analytical methods/tools to develop PoF models to predict reliability of electronic interconnects in a variety of fielded environments and manufacturability through the assembly process.


  • BS degree in Mechanical Engineering, Materials Science, Applied Physics, or related discipline with 9 years of professional experience with a bachelors, or (7 years with MS; 4 PhD) in IC packaging.
  • Previous experience with tools ANSYS Workbench or other similar packaging simulation/modeling tools.
  • Previous experience with IC packaging modeling & simulation, and packaging failure analysis
  • Experience with IC encapsulation and bonding (wire bonding, flip chip, etc.) including lead or lead-free solders, and related bonding/processing technology.
  • Ability to solve complex problems with a high level of mathematical ability, methodical and logical approach with accuracy and attention to detail.
  • A strong background in mechanical and thermal sciences with emphasis on analytical, measurement methods, and failure analysis.
  • Excellent understanding of PoF of micro-interconnects (such as solder joint fatigue, underfill delamination, creep, fracture mechanics).
  • Thorough knowledge of material properties and material property test methods (non-linear deformation, viscous behavior, etc).
  • Manage multiple projects and effectively influence and communicate with internal customers.
  • U.S. Citizen and the ability to obtain and maintain a U.S. Secret security clearance


  • Experience with package modeling using ANSYS Sherlock Automated Design Analysis.
  • Nonlinear multi-physics structural and thermal experience using FEA.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.

This position reports to Linthicum, MD, USA, however, this position can also be worked from Unknown, VA, VA, USA.

Salary Range: $112,300 USD - $168,500 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

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What's great about
Northrop Grumman

  1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
  2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
  3. Enjoy benefits like work-life balance, education assistance and paid time off.

Did you know?

Northrop Grumman leads the industry team for NASA’s James Webb Space Telescope, the largest, most complex and powerful space telescope ever built. Launched in December 2021, the telescope incorporates innovative design, advanced technology, and groundbreaking engineering, and will fundamentally alter our understanding of the universe.