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Sr. Principal Microelectronics Product Engineer

Requisition ID: R10037182

  • Category IconCategory: Engineering
  • Location IconLocation: Apopka, Florida, United States of America
  • Citizenship IconCitizenship Required: United States Citizenship
  • Clearance IconClearance Type: Secret
  • Telecommute IconTelecommute: Yes-May consider hybrid teleworking for this position
  • Shift IconShift: 1st Shift (United States of America)
  • Travel IconTravel Required: Yes, 10% of the Time
  • Positions IconPositions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking a talented and motived Sr. Principal Microelectronics Product Engineer for our Advanced Packaging Technology µ-Line - located in Apopka, Florida.

Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. The Apopka Florida wafer bumping µ-Line, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs.  The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar.  Techniques will include sputter, electro plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.

The Microelectronics Product Engineer is responsible for supporting the Program Management organization which is currently remote from the Apopka facility. The Product Engineer will be a liaison/POC for technical interface between the internal Engineer Design, Manufacturing, and Quality organizations.  The support responsibility includes, but is not limited to external FAB issues, product transfers, ensuring cost, quality, and device delivery objectives are satisfied.

What You’ll Get to Do:

  • Track and analyze functional test yields
  • Perform post-test “Engineering Evaluation” which includes high level yield review and picklist verification
  • Disposition lots post-test, based on data review
  • Standup plotting and reports for product yields
  • Interface between design, µ-Line, and test on yield detractors, degrades
  • Support inspection and any additional process flow work (e.g. clean, assembly, pedigree)
  • Interface for issues, yield fallout
  • Maintain product related documentation, including specs, test process flows, etc.
  • Provide support on overall product trouble shooting and root cause issues
  • Drive/Support production requirement activities (e.g. CCBs, RCCA, FMEA, Design Try Out (DTO))

The successful candidate will be able to review & map product requirements per specification documents; will have the ability to support/perform final product validations against customer requirements; will be able to analyze and manipulate data and will have experience with Front End of Line (FEOL) and Back End of Line (BEOL) device integration.  He/she will possess strong interpersonal and communication skills, both written and verbal; will have problem solving skills and the ability to work with a diverse group of people including technicians, engineers, and management. 

The ideal candidate will have the ability to apply engineering judgment to production tests - often reviewing with program & designers before disposition; the ability to be successful utilizing limited historical yield baseline, i.e. <20 wafers; and the ability to be successful utilizing distribution derived limits typically challenged by limited statistics & lot-to-lot sampling.  He/she will have experience with Lean Manufacturing; Statistical Process Control; Failure Analysis including SEM data analysis for effects on product performance; will be familiar with Schematic Troubleshooting and continuous Improvement techniques. 

Basic Qualifications:

  • Bachelor’s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 9 years (or Master’s degree plus 7 years; or PhD plus 4 years) of relevant experience.
  • Familiarity with wafer Test and bump manufacturing process
  • Basic understanding of semiconductor device physics and operation
  • Ability to obtain and maintain a Department of Defense Secret clearance (US citizenship required)

Preferred Qualifications:

  • Experienced with semiconductor qualification, DOEs, and reliability mechanisms
  • Understanding of analog, digital and RF device test, and characterization techniques.
  • Yield enhancement or manufacturing experience including six sigma disciplines and SPC
  • Experience in lean manufacturing practices and structured problem-solving methodology
  • Experience with JMP, Minitab, Python, Tableau, or similar statistical analysis tools
  • Experience with yieldWerx or similar semiconductor test data analytics packages
  • Experience developing technical specifications for equipment procurement
  • Active Secret Clearance


Salary Range: $98,700 USD - $148,100 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

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What's great about
Northrop Grumman

  1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
  2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
  3. Enjoy benefits like work-life balance, education assistance and paid time off.

Did you know?

Northrop Grumman leads the industry team for NASA’s James Webb Space Telescope, the largest, most complex and powerful space telescope ever built. Launched in December 2021, the telescope incorporates innovative design, advanced technology, and groundbreaking engineering, and will fundamentally alter our understanding of the universe.