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Principal Microelectronic (BEOL) Process and Equipment Engineer

Requisition ID: R10048324

  • Category IconCategory: Engineering
  • Location IconLocation: Apopka, Florida, United States of America
  • Citizenship IconCitizenship Required: United States Citizenship
  • Clearance IconClearance Type: Interim Secret
  • Telecommute IconTelecommute: No- Teleworking not available for this position
  • Shift IconShift: 1st Shift (United States of America)
  • Travel IconTravel Required: Yes, 10% of the Time
  • Positions IconPositions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking a talented and motived Microelectronics Back End of Line (BEOL) Process and Equipment engineer for our Advanced Packaging Technology µ-Line - located in Apopka, Florida.

Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. 

The Apopka Florida wafer bumping µ-Line, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs.  The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar.  Techniques will include sputter, electro plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.

The back-end process engineer is responsible for equipment and wafer handling processes utilized in wafer bonding and debonding (Thermal or Mechanical) and bump flux coating and reflow (automatic load, coat, reflow, unload system).  

Roles and Responsibilities:

The areas of focus will be in the Back End Wafer Fab processes which encompasses wafer bond and debond processes in support of sensitive and potentially fragile wafer bumping structures of various aspect ratios and materials.  Flux application and reflow processes will also fall under this individual’s scope of responsibility.    

The selected candidate will have responsibility for

Starting up and maintaining a wafer bonding and debonding process including tool installation and qualification Starting up and maintaining a plated bump solder flux automated load /unload, application, and reflow process including tool installation and qualification.  The scope may include related metrology processes to define and support specifications. Designing and executing process/equipment improvement projects Developing new processes based on production and development program requirements Establishing standard operating procedures and engaging the operations team to ensure these are followed Supporting statistical process control (SPC) and continuous improvement efforts Training technicians and maintaining process documentation

This is a full-time 1st shift position. Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.

Required Skills

  • Experience in developing wafer bonding and debonding process with multiple material types
  • Experience in developing solder flux processes with multiple solder material types.  Experience should include development and supporting subsequent flux cleaning processes as applicable.
  • Experience in process development utilizing DOE’s for optimizing processes to create robust products and manufacturing yields
  • Experience working with prototype materials for new product introduction

Preferred Skills

  • Wafer bump process development and optimization
  • BEOL wafer Photo Lithography process development and optimization.
  • Expertise in repair, maintenance, installation, of backend semiconductor equipment
  • Lean Manufacturing
  • Statistical Process Control
  • Failure Analysis, SEM, Cross Section, X-ray
  • Continuous Improvement techniques

Basic Qualifications:

Bachelor’s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 5 years of relevant experience

Must be familiar in backend processing

Basic understanding of semiconductor devices

Candidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including technicians, engineers and management.

Ability to obtain and maintain a Secret clearance (US citizenship required)

Preferred Qualifications:

Bachelor’s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 7 years of relevant experience

Experience in lean manufacturing practices and structured problem-solving methodology

Experience with SPC, DOEs, JMP, Minitab, or similar statistical analysis tools

Experience leading and guiding the fab operation teams

Experience developing technical specifications for process material procurement

Experience developing technical specifications for equipment procurement

Active Secret clearance


Salary Range: $87,600 USD - $131,400 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

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What's great about
Northrop Grumman

  1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
  2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
  3. Enjoy benefits like work-life balance, education assistance and paid time off.

Did you know?

Northrop Grumman leads the industry team for NASA’s James Webb Space Telescope, the largest, most complex and powerful space telescope ever built. Launched in December 2021, the telescope incorporates innovative design, advanced technology, and groundbreaking engineering, and will fundamentally alter our understanding of the universe.