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Principal Microelectronic Plating Process Engineer

Requisition ID: R10048325

  • Category IconCategory: Engineering
  • Location IconLocation: Apopka, Florida, United States of America
  • Citizenship IconCitizenship Required: United States Citizenship
  • Clearance IconClearance Type: Secret
  • Telecommute IconTelecommute: No- Teleworking not available for this position
  • Shift IconShift: 1st Shift (United States of America)
  • Travel IconTravel Required: Yes, 10% of the Time
  • Positions IconPositions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking a talented and motived Microelectronics Plating Process Engineer for our Advanced Packaging Technology µ-Line - located in Apopka, Florida.

Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. 

The Apopka Florida wafer bumping µ-Line, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs.  The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar.  Techniques will include sputter, electro plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers.  The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.

The Plating Process Engineer is responsible for supporting and sustaining electro-plating tools from development to production programs.  The responsibility will also include the support of plating related metrology systems and equipment. 


Responsibilities include:

- Qualifying and sustaining new recipes and associated process documentation.

- Sustaining equipment and processes including running process qualifications, process and equipment troubleshooting, technician training and certification, and process safety.

- Developing, optimizing, and sustaining new process flows, to include plating and metrology documentation authoring.

- Supporting analysis of a Ni, Cu, Lead/Tin and Gold plating chemistries.

- Supporting statistical process control (SPC) and continuous improvement efforts.

- Determining preventative maintenance improvement opportunities and supporting procedure updates and schedules.


-BS Degree in Chemical Engineering, Electrical Engineering, Materials, Chemistry, Physics, or related technical discipline with 5 years of relevant semiconductor experience (3 with an MS).

-Hands-on experience with the following semiconductor process/equipment areas:

- Electrochemical or electroless plating of one or more typical bump metallurgies (Pb/Sn, SnAgCu, SnAg, Cu, Ni, Au, etc).-

            - Sputter deposition of one or more typical UBM films (Ti, TiW, Ni, Cu, Au).

-Must be a US Citizen and able to obtain and maintain a Secret clearance.

Preferred Qualifications:

-Experience in wafer bumping or packaging lines

-Experience in low volume/high product mix environments

-Hands-on experience in two or more of the following semiconductor process/equipment areas:

- Electrochemical or electroless plating of one or more typical bump metallurgies (Pb/Sn, SnAgCu, SnAg, Cu, Ni, Au, etc)

- Contact lithography and photoresist chemistries and processing

            - Wet chemical processes for metal etching (Ti, TiW, Ni, Cu)

            - Sputter deposition of one or more typical UBM films (Ti, TiW, Ni, Cu)

            - Solder sphere transfer / ball drop processing

            - Wafer dry and wet clean processes

-Personal Clearance Level- Secret


Salary Range: $87,600 USD - $131,400 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

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What's great about
Northrop Grumman

  1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
  2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
  3. Enjoy benefits like work-life balance, education assistance and paid time off.

Did you know?

Northrop Grumman leads the industry team for NASA’s James Webb Space Telescope, the largest, most complex and powerful space telescope ever built. Launched in December 2021, the telescope incorporates innovative design, advanced technology, and groundbreaking engineering, and will fundamentally alter our understanding of the universe.