Senior Principal Manufacturing Engineer – Advanced Microelectronics Packaging

Requisition ID: R10010069

  • Category IconCategory: Engineering
  • Location IconLocation: Baltimore - MD, United States of America
  • Citizenship IconCitizenship Required: United States Citizenship
  • Clearance IconClearance Type: None
  • Telecommute IconTelecommute: Yes- May Consider Occasional/Part-Time Teleworking for this position
  • Shift IconShift: 1st Shift (United States of America)
  • Travel IconTravel Required: No
  • Positions IconPositions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman's Advanced Packaging Manufacturing Engineering organization is seeking a Senior Principal Advanced Microelectronics Packaging Engineer to lead our development initiatives focused around 2 and 3D assembly technologies.

The Advanced Packaging Manufacturing Engineering team engages with low manufacturing readiness level (MRL) programs to ensure manufacturing capabilities required for strategic applications are being developed and are ready for implementation into production. The Packaging Engineer will engage with product development during pre-proposal and proposal program phases to offer insight into higher yielding, novel and evolving advanced microelectronics manufacturing processes.

The Packaging Engineer will identify, scope, and lead IRAD and CRAD efforts leveraging advanced semiconductor packaging technologies to enable higher capability and lower cost next generation sensors. She/he will also support design of new 2D and 3D packaging concepts.

The chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high visibility environment; and work well as part of a team.


Basic Qualifications: 

  • Bachelors of Science degree or higher in Engineering or related STEM area plus 9 years of relevant professional experience (7 years with an MS degree)
  • Broad knowledge of semiconductor RF/digital packaging, materials and assembly processes including some of these: wafer bumping, wafer bonding, silicon interposers and flip chip assembly
  • Fundamental understanding of semiconductor fabrication processes and technology with strong technical and analytical skills and problem-solving techniques
  • Demonstrated ability to successfully lead teams in a highly matrixed environment
  • Candidate must be able to obtain a security clearance (U.S. citizenship is required.)

Preferred Qualifications: 

  • Experience with wafer level semiconductor manufacturing technology
  • Experience with photonic transceiver technology
  • Experience with wafer testing
  • Experience with supply chain management
  • Experience with package reliability qualification
  • Demonstrated technical innovation and delivered results for complex, time-critical technical projects
  • Experience managing budgets, resources and timelines, as well as proven stakeholder management

    Salary Range: 108864 - 163296

    Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

    The health and safety of our employees and their families is a top priority. With the continuing impacts of COVID-19 around the world, we are taking action to protect the health and well-being of our colleagues and maintain the safety of the communities where we operate. As a federal contractor, and consistent with Executive Order 14042 ( we will require all newly hired employees in the United States to be fully vaccinated by January 18, 2022 or by your start date if it is after January 18th. Federal guidance allows for disability/medical and religious accommodations with respect to the vaccine requirement. Any requested accommodations must be reviewed and approved (if applicable) in advance of your start date.

    Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

    Apply Now


    Apply Now

    What's great about
    Northrop Grumman

    1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
    2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
    3. Enjoy benefits like work-life balance, education assistance and paid time off.

    Did you know?

    We offer an array of benefits to give you the support you need, including matching 401K, tuition assistance, health insurance and wellness options, coaching, mentoring and more.