Associate Engineer Microelectronic Semiconductors
Requisition ID: R10171983
- Category: Engineering
- Location: Apopka, Florida, United States of America
- Clearance Type: Interim Secret
- Telecommute: No- Teleworking not available for this position
- Shift: 1st Shift (United States of America)
- Travel Required: Yes, 10% of the Time
- Positions Available: 1
Northrop Grumman Mission Systems seeks a talented and motivated Microelectronics Associate Process Engineer for our Advanced Packaging Technology µ-Line in Apopka, Florida.
Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development.
The Apopka Florida wafer bumping µ-Line will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions. Techniques will include sputter, electro-plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.
The Associate Process Engineer will support and sustain a wide range of wafer bumping processes.
Responsibilities include:
- Support multiple wafers bumping processes.
- Support development and leading the aspects of the qualification of new bump and micropump compositions and process flows.
- Working with cross-site program, test, and reliability teams to achieve package qualifications and troubleshoot manufacturing and development issues.
- Ability to understand program package requirements and support advisement on suitable bump metallurgies and process flows as applicable.
- Support as required technical interface activities between wafer bumping lines, site management, and internal programs.
- Troubleshoots existing processes to improve safety, quality, cost, and efficiency.
- incorporates engineering changes into the work process.
- Research and evaluate commercially available tools and equipment to support manufacturing processes.
- Coordinates with production on day-to-day activities. Assists in the resolution of processing issues.
- Willingness to have position transition from 1st shift to 2nd Shift in the future.
Required Qualifications
- Bachelor's degree in Chemical Engineering, Materials, Chemistry, Physics, or related STEM discipline and a minimum of 1 year of semiconductor cleanroom experience
- Experience in a manufacturing environment
- Ability to obtain and maintain a DoD Secret clearance
- US Citizenship
Preferred Qualifications
- Experience using SPC and Six Sigma techniques.
- Prior experience with semiconductor-industry-capable process tools
- Understanding of UBM and solder bump metallurgy and how they impact package reliability.
- Experience with both lead and lead-free bump technologies.
- Experience in flip-chip, 2.5D, and 3D packaging.
MANUMS
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
What's great about
Northrop Grumman
- Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
- Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
- Enjoy benefits like work-life balance, education assistance and paid time off.
Did you know?
Northrop Grumman leads the industry team for NASA’s James Webb Space Telescope, the largest, most complex and powerful space telescope ever built. Launched in December 2021, the telescope incorporates innovative design, advanced technology, and groundbreaking engineering, and will fundamentally alter our understanding of the universe.