Principal Mechanical Electronic Packaging Engineer/ Senior Principal Mechanical Electronic Packaging Engineer

Northrop Grumman Mission Systems is seeking a Principal Mechanical Electronic Packaging Engineer/ Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals.  This position will be located in Linthicum, Maryland.

Overview:

You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms.  You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website:  https://www.northropgrumman.com/what-we-do/air/active-electronically-scanned-array-aesa-radars/

As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems.

This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.

Roles and Responsibilities include:

• Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
• Collaboration within a cross-functional Integrated Product Team (IPT);  effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
• Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
• Providing technical leadership and mentoring to less experienced personnel.

Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:

• Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
• Proficient with AutoCAD
• Familiarity with NX or other 3D modeling software

Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:

• Bachelor’s degree with 9 years of experience, a Master’s degree with 7 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
• Proficient with AutoCAD
• Familiarity with NX or other 3D modeling software

Preferred Qualifications:

• Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• Active DoD Secret Clearance or higher
• Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
• Familiarity with thermal and structural analysis considerations, methodologies, and software tools
• Experience with hands-on assembly and testing of prototype electronic hardware
• Experience in a technical leadership role on a cross-functional product development team

This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher.

As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including: 

• Medical, Dental & Vision coverage
• 401k
• Educational Assistance
• Life Insurance
• Employee Assistance Programs & Work/Life Solutions
• Paid Time Off
• Health & Wellness Resources
• Employee Discounts 

Link to Benefits: https://totalrewards.northropgrumman.com/  

This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off. 

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.