Sr. Principal IC Packaging Modeling Engineer

Requisition ID: R10017238

  • Category IconCategory: Engineering
  • Location IconLocation: Linthicum - MD, United States of America
  • Citizenship IconCitizenship Required: United States Citizenship
  • Clearance IconClearance Type: Secret
  • Telecommute IconTelecommute: Yes- May Consider Occasional/Part-Time Teleworking for this position
  • Shift IconShift: 1st Shift (United States of America)
  • Travel IconTravel Required: Yes, 10% of the Time
  • Positions IconPositions Available: 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

As a Senior Principal IC Package Modeling Engineer at Northrop Grumman you will have a challenging and rewarding opportunity to be a part of our Enterprise-wide digital transformation. Through the use of Model-based Engineering, DevSecOps and Agile practices we continue to evolve how we deliver critical national defense products and capabilities for the warfighter. Our success is grounded in our ability to embrace change, move quickly and continuously drive innovation.

The successful candidate will be collaborative, open, transparent, and team-oriented with a focus on team empowerment & shared responsibility, flexibility, continuous learning, and a culture of automation. We are seeking an enthusiastic, motivated engineer to join our team at our Linthicum, Maryland location.

Job responsibilities include, but are not limited to:

  • Develop thermo-mechanical and mechanical FEA models and perform simulations to support package assembly process and reliability/qualification testing.
  • Evaluate designs for manufacturability and reliability; oversee metrology and failure analysis of packaging components
  • Analyze, model, and interpret data for advanced package development and related areas and provide material, structural, and assembly/fab process condition recommendations.
  • Iterate between developing FEA or other models and experimental validation.
  • Work within a lab environment and perform root-cause analysis of electronic hardware using failure analysis tools/techniques: Mechanical Cross-Sectioning, Optical Microscopy, Acoustic Microscopy (C-SAM) and Scanning Electron Microscopy (SEM).
  • Use analytical methods/tools to develop PoF models to predict reliability of electronic interconnects in a variety of fielded environments and manufacturability through the assembly process.
  • Outstanding written and verbal communication skills with the ability to clearly and concisely present technical findings and corrective action recommendations to internal and external customers.

Basic Qualifications

A candidate must meet ALL of the below criteria. The candidate must:

  • BS degree in Mechanical Engineering, Materials Science, Applied Physics, or related discipline with 9 years of professional experience with a bachelors, or (7 years with MS; 4 PhD) in IC packaging.
  • Previous experience with tools ANSYS Workbench or other similar packaging simulation/modeling tools.
  • Previous experience with IC packaging modeling & simulation, and packaging failure analysis
  • Experience with IC encapsulation and bonding (wire bonding, flip chip, etc.) including lead or lead-free solders, and related bonding/processing technology.
  • Ability to solve complex problems with a high level of mathematical ability, methodical and logical approach with accuracy and attention to detail.
  • A strong background in mechanical and thermal sciences with emphasis on analytical, measurement methods, and failure analysis.
  • Excellent understanding of PoF of micro-interconnects (such as solder joint fatigue, underfill delamination, creep, fracture mechanics).
  • Thorough knowledge of material properties and material property test methods (non-linear deformation, viscous behavior, etc).
  • Manage multiple projects and effectively influence and communicate with internal customers.
  • Ability to obtain and maintain a Secret clearance

Preferred Qualifications

  • Experience with package modeling using ANSYS Sherlock Automated Design Analysis.
  • Nonlinear multi-physics structural and thermal experience using FEA.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.

Salary Range: 108900 - 163300

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. With the continuing impacts of COVID-19 around the world, we are taking action to protect the health and well-being of our colleagues and maintain the safety of the communities where we operate. As a federal contractor, and consistent with Executive Order 14042 ( we will require all newly hired employees in the United States to be fully vaccinated by January 18, 2022 or by your start date if it is after January 18th. Federal guidance allows for disability/medical and religious accommodations with respect to the vaccine requirement. Any requested accommodations must be reviewed and approved (if applicable) in advance of your start date.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

Apply Now


Apply Now

What's great about
Northrop Grumman

  1. Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
  2. Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
  3. Enjoy benefits like work-life balance, education assistance and paid time off.

Did you know?

We offer an array of benefits to give you the support you need, including matching 401K, tuition assistance, health insurance and wellness options, coaching, mentoring and more.