Mechanical Electronic Packaging Engineer, Principal / Sr. Principal

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking a Principal\Sr. Principal Microelectronic Packaging Mechanical Design Engineer to join our team of qualified, diverse individuals.  This position will be located in Linthicum, Maryland.

Overview:

You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms.  You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website:  https://www.northropgrumman.com/what-we-do/air/active-electronically-scanned-array-aesa-radars/
 

Roles and Responsibilities include:

• Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
• Collaboration within a cross-functional Integrated Product Team (IPT);  effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
• Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
• Providing technical leadership and mentoring to less experienced personnel.
   

Education and Experience:

This position may be filled at the Principal Engineer level, or Sr. Principal Engineer level.

• Principal Microelectronic Packaging Mechanical Design Engineer : Bachelor of Science in Mechanical Engineering or closely related field and 5 years of relevant experience; or, Master of Science in Mechanical Engineering or closely related field and 3 years of relevant experience, or a PhD in a relevant field
• Sr. Principal Microelectronic Packaging Mechanical Design Engineer : Bachelor of Science in Mechanical Engineering or closely related field and 9 years of relevant experience; or, Master of Science in Mechanical Engineering or closely related field and 7 years of relevant experience, or a PhD in a related field and 4 years of experience

Basic Qualifications: 

• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
• Proficient with AutoCAD
• Familiarity with NX or other 3D modeling software
• US Citizen, with ability to obtain a DOD Secret or higher security clearance
• Strong oral and written communication, attention to detail, and innovative thinking skills
• Ability to work independently, as well as in a team environment
• Self-motivated with the ability to effectively organize and prioritize job assignments and tasks, within project schedule and budgetary constraints
   

Preferred Qualifications: 

• Active DOD Secret or higher security clearance
• Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
• Familiarity with thermal and structural analysis considerations, methodologies, and software tools
• Experience with hands-on assembly and testing of prototype electronic hardware
• Experience in a technical leadership role on a cross-functional product development team

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This position reports to Linthicum, MD, USA, however, this position can also be worked from Unknown, VA, VA, USA.

Salary Range: $90,600 USD - $136,000 USD

Salary Range 2: $112,300 USD - $168,500 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.