Process Integration / Principal Process Integration Engineer
Requisition ID: R10179691
Category: Engineering
Location: Linthicum, Maryland, United States of America
Clearance Type: SCI
Telecommute: No- Teleworking not available for this position
Shift: 2nd Shift (United States of America)
Travel Required: Yes, 10% of the Time
Relocation Assistance: Relocation assistance may be available
Positions Available: 1
Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and Semiconductor Process Integration Engineer or Principal Semiconductor Process Integration Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs.
Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn through a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms.
What You'll get to Do:
The Semiconductor Process Integration Engineer will be focused on Superconducting Electronics with a focus on Reciprocal Quantum Logic (RQL) devices. The candidate will need to support inspection and disposition of engineering material. The successful candidate will also support program execution for programs within the Micro Systems Technologies portfolio. Excellent verbal and written communication skills are required
Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.
This requisition may be filled as a Semiconductor Process Integration Engineer or Principal Semiconductor Process Integration Engineer
Basic Qualifications for Semiconductor Process Integration Engineer
Bachelor’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 2 years of relevant experience; or a Master’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 0 years of relevant experience.
U.S. Citizenship required.
The ability to obtain and maintain a DoD TS/SCI with poly clearance is required.
Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration.
Must have an aptitude for hands-on laboratory and experimental work.
Must have an aptitude for defectivity reduction and continuous process improvements.
Must be willing to work 2nd shift (Mon-Fri) 2:00pm-11:30pm (9/80 schedule available).
Must be willing to work a sustainment position in a fabrication environment.
Basic Qualifications for Principal Semiconductor Process Integration Engineer
Bachelor’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 5 years of relevant experience; or a Master’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 3 years of relevant experience; or a PhD in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 0 years of relevant experience.
U.S. Citizenship required.
The ability to obtain and maintain a DoD TS/SCI with poly clearance is required.
Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration.
Must have an aptitude for hands-on laboratory and experimental work.
Must have an aptitude for defectivity reduction and continuous process improvements.
Must be willing to work 2nd shift (Mon-Fri) 2:00pm-11:30pm (9/80 schedule available).
Must be willing to work a sustainment position in a fabrication environment.
Preferred Qualifications:
Active TS/SCI clearance
Course work in semiconductor processing, analog and microwave electronic circuits
FEOL and BEOL semiconductor fabrication experience
DC test analysis and production engineering experience
Knowledge of yield improvement and defect reduction.
Experience with DOEs, JMP, and statistical analysis
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Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
What's great about
Northrop Grumman
- Be part of a culture that thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
- Use your skills to build and deliver innovative tech solutions that protect the world and shape a better future.
- Enjoy benefits like work-life balance, education assistance and paid time off.
Did you know?
Northrop Grumman leads the industry team for NASA’s James Webb Space Telescope, the largest, most complex and powerful space telescope ever built. Launched in December 2021, the telescope incorporates innovative design, advanced technology, and groundbreaking engineering, and will fundamentally alter our understanding of the universe.