Associate Microelectronics Semiconductor Engineer / Microelectronics Semiconductor Engineer

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Emerging Capabilities Development group of Northrop Grumman Mission Systems is seeking an Associate Microelectronics Semiconductor Engineer/ Microelectronics Semiconductor Engineer in the Wet Etch and Surface Prep Group for our Advanced Technology Lab (ATL).  Located outside of Baltimore, Maryland we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground-based radars, avionic radars, and space systems. Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country.

The qualified candidate will have knowledge of wet etch and surface prep processing for semiconductor and device fabrication. Candidate will join a production team working closely with multiple programs and area managers to support on-time delivery of products derived from a variety of III-V HBT and FET compound semiconductor technologies. As an Associate Microelectronics Semiconductor Engineer/ Microelectronics Semiconductor Engineer in the Wet Etch and Surface Prep Group you will interface with both peers and representatives from operations, equipment engineering, process integration, and program management. You will support research, design, and development of new microelectronic, optoelectronic, micro-electromechanical and sensor manufacturing processes with Si, GaAs, GaN, SiC and related III-V materials. The candidate will utilize wet processing equipment to support development of new techniques for fabrication of semiconductor technologies and will support Process Integrators and Senior Process Engineers on development of wets processes for new devices.

Core responsibilities for this position include monitoring and maintaining wet etch processing tools, process specifications, continuous improvement initiatives, tool installation, technician training, and RCA investigations under the supervision of senior engineers. Candidate must have experience in semiconductor processing in wet etch and surface prep.

#NGATL

This requisition may be filled as either an Associate Microelectronics Semiconductor Engineer OR Microelectronics Semiconductor Engineer

Basic Qualifications for Associate Microelectronics Semiconductor Engineer:

- Must have Bachelor's degree in Chemical, Electrical, or Materials Engineering or related discipline.

- Must have general MS Office suite experience

Basic Qualifications for Microelectronics Semiconductor Engineer:

- Must have Bachelor's degree in Chemical, Electrical, or Materials Engineering or related discipline with 2 yrs. semiconductor fabrication experience OR a Master’s degree in Chemical, Electrical, or Materials Engineering or related discipline with no experience.

- Must have general MS Office suite experience

Preferred Qualifications:
-Solid State Physics or other relevant engineering/physical science disciplines.

-Semiconductor manufacturing experience

-Wet etch process engineering for GaAs-, SiC-, and/or GaN-based devices.

-HBT and PHEMT fabrication experience

Salary Range: $67,000 USD - $100,600 USD

Salary Range 2: $81,000 USD - $121,600 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.