Hardening the Future
Exploring New Ways to Harden Microelectronics for the Harshest Environments
By Nestor Vences Gonzalez
In space, radiation is one of the greatest threats to a spacecraft’s microelectronics components, wreaking havoc on the delicate, tiny parts that power the spacecraft. Now, a Northrop Grumman team is testing methods that could revolutionize how future spacecraft semiconductors are protected — or hardened — against radiation.
“We can increase the radiation tolerance of semiconductors — the electricity channels in chips — by changing the fabrication process or by designing the chips to anticipate radiation, thus lowering cost and increasing capabilities,” said Dan Benveniste, a Northrop Grumman engineering strategist leading the team researching solutions for this problem.
This research could enable on-orbit microelectronics to better keep pace with innovations of those on the ground. As microelectronics advance, the extra hurdle of incorporating radiation hardening into the latest designs can take years, causing a technological lag between commercial chips on Earth and those on spacecraft.
“Microelectronics created for our cellphone, cars and computers wouldn’t last outside of Earth’s atmosphere,” said Mike Wojtowicz, a Northrop Grumman fellow. “Coupled with significant testing, we can ensure that our critical technology is shielded from the harsh space environment while maintaining optimal functionality.”
Designing to Survive
Since 1963, Northrop Grumman has been a leader in radiation and survivability engineering, pioneering innovations on programs such as the intercontinental ballistic missile, the James Webb Space Telescope, Next-Gen Polar, Space Development Agency Tranche programs and more.
To prepare a spacecraft for space, survivability engineers define the spacecraft’s radiation effects requirements — such as how much radiation the spacecraft and its microelectronics must be able to withstand, which varies depending on the mission — then design and test the spacecraft and its components against those requirements. If a spacecraft’s elements don’t meet the requirements, they redesign as needed until they do.
Dan’s team is exploring two complementary hardening approaches: by process and by architecture.
“The radiation hardening by process (RHBP) changes silicon chip fabrication,” said Dan. In partnership with VORAGO Technologies and GlobalFoundries, the team has developed processing techniques to either more quickly create a new radiation-hardened design with commercial IP, when necessary, or harden an existing design without changing their existing design. This innovative approach could allow future engineers to harden a design instead of designing a new chip for every mission.
“By adding a couple of steps to the typical fabrication process, we hope to greatly improve radiation protection at a minimal cost,” said Dan.
The architectural approach doesn’t change the design of the chips but transforms how chips operate in space.“ In partnership with Intel, we are taking off-the-shelf chips and augmenting them in new ways that give us new capabilities for space,” said Dan, noting this approach opens the doors for the most advanced commercial chips, delivering cutting-edge capabilities for space applications at a reduced cost.
A New Day
“As space missions become more complex, demand for powerful, resilient chips will grow ,” said Dan. If successful, the team’s methods — which will be demonstrated for the first time on an advanced node semiconductor this year — would be able to meet these demands with speed and at cost.
“Northrop Grumman’s long history of innovation is continuing with investment in critical technologies, like microelectronics, that are needed to support our customer’s missions,” said Dan. "With these novel radiation hardening approaches, Northrop Grumman is leading the effort to deliver affordable access to the next generation of advanced semiconductors for space missions."
Learn more about Northrop Grumman’s leadership in microelectronics.