Microelectronics Leadership
Matt Hicks
Sr. Director of Foundries, Test & Advanced Packaging (FTAP), Northrop Grumman Microelectronics Center, Northrop Grumman Mission Systems
Matt Hicks is the Sr. Director of Northrop Grumman’s Foundries, Test & Advanced Packaging (FTAP) organization. This organization consists of the Advanced Technologies Labs (ATL; based in Linthicum Heights, MD), Space Park Foundry (SPF; based in Redondo Beach, CA) and Advanced Packaging (based in Linthicum Heights, MD, Redondo Beach, CA and Apopka, FL).
Mike Barsky
General Manager of Microelectronics Products and Services, Northrop Grumman Space Systems
Mike Barsky is the director and general manager of Microelectronics Products and Services Operating Unit, which provides external access to the Northrop Grumman Corporation microelectronics foundry at Space Park. Barsky is responsible for the commercial storefront and business deals with clients in the commercial and aerospace industries.
Ben Heying, PhD.
Director of Microelectronics, Northrop Grumman Microelectronics Center
Ben Heying is responsible for Managing a Northrop Grumman Microelectronics Center Foundry in Redondo Beach, CA. This Trusted facility is responsible for manufacturing and developing advanced semiconductors for Northrop Grumman’s Space, DoD, and Commercial systems.
Randy Sandhu
Director, Manufacturing Science and Technology Northrop Grumman Mission Systems
Rajinder Sandhu is the director of the Manufacturing Science and Technology operating unit under Northrop Grumman’s Microelectronics Center. Sandhu is responsible for leading the strategy, capture, and execution of multiple programs in the center, which include several key pursuits under the CHIPS ACT.
Louise Sengupta
Director, Business Development, Northrop Grumman Microelectronics Center, Mission Systems
Dr. Louise Sengupta is currently the Director of Business Development and Capture for Northrop Grumman Microelectronics Center (NGMC) that includes both Mission Systems and Space Systems sectors. She is responsible for growing the business and creating the go to market strategy for all new business in microelectronics across all services and across the company.
Zachary Keane
NG Fellow and Chief Engineer, Microelectronics Designs and Applications, Northrop Grumman Mission Systems
Zachary Keane is the Chief Engineer for the Microelectronics Designs and Applications business area within the Northrop Grumman Microelectronics Center (NGMC). In this position, Keane is responsible for leading a multifunctional team of scientists and engineers who develop discriminating technologies for advanced computing.
David Shahin
Manager, Advanced Packaging Operating Unit, Northrop Grumman Microelectronics Center; Mission Systems
David Shahin is the Manager of the Northrop Grumman Microelectronics Center’s Advanced Packaging Operating Unit. He is focused on advanced packaging technology deployment to serve defense & critical microelectronics systems, from new technology development to production deployment across NG’s end-to-end microelectronics capabilities and strategic partners.
Brian Heldmann
Chief Engineer; Northrop Grumman Mission Systems
Brian Heldmann is chief engineer at Northrop Grumman, focused on supply chain strategy and advanced operations. Having worked at Northrop Grumman for 15 years, Heldmann has extensive experience in microelectronics technologies, specifically advanced packaging and other strategic endeavors related to the advanced packaging ecosystem.
Karen Renaldo
Microelectronics Consulting Engineer, Northrop Grumman Mission Systems
Karen M. Renaldo is a Microelectronics Consulting Engineer at Northrop Grumman. She is recognized for advancing innovative products at the Advanced Technology Lab (ATL) and creating new business opportunities through advanced materials and techniques.
Justin Parke
Consulting Engineer, Northrop Grumman Mission Systems
Justin Parke is a consulting engineer and Technical Fellow at the Advanced Technology Lab (ATL) in the Northrop Grumman Microelectronics Center where he specializes in microelectronic device development, fabrication, testing, and reliability assessment. As a member of the process integration group, he has taken the SLCFET technology from proof of concept to production in the last 15 years.
About Northrop Grumman
Northrop Grumman is a leading global aerospace and defense technology company. Our pioneering solutions equip our customers with the capabilities they need to connect and protect the world, and push the boundaries of human exploration across the universe. Driven by a shared purpose to solve our customers’ toughest problems, our nearly 100,000 employees define possible every day.